

Semiconductor Mold Cleaning Material
Advantages
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Excellent mold clearing performance (can be applied to various types of encapsulation materials)
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Improve the number of die pressing, significantly improving customer production efficiency
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Improve the service life of production equipment (reduce the number of times the mold disassembled and cleaned)
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With different grades of products, time of plasticization can be shortened according to customer needs.
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Environment-friendly and easy to store (room temperature storage, no need for refrigeration)
Details
Cleaning Materials for Semiconductor Molds
Mold Release Recovery Material for Semiconductor (Molding Agent)
We have developed melamine-based cleaning materials to remove epoxy resin encapsulation materials from molds in the semiconductor mold process. There are two types of cleaning materials: ingot type and cake type, which can be used for different processes, applications, and characteristics.
Pioneer of Cleaning Materials for Semiconductor Molds
Adhesive Formation after Encapsulation with Epoxy Resin
Cleaning Materials for Semiconductor Metal Mold Formation after ECR Cleaning
There is no need to disassemble the mold, and the stain on the mold can be cleaned under the same process in the reprocessing operation
Take advantage of the high cleaning performance of melamine resin to make a great contribution to the improvement of semiconductor production capacity for customers